Customized Non Silicone Release Film 23μM PET Release FIlm For Low VOC Applications

23 μm Non Silicone Release Film Non-silicone Film For Low VOC Applications

PET/PI/OPP substrate coated with a layer of non-silicon release material, the product is mainly used in FPC/PCB process, TPU casting protection, silicone protective film and new energy electronics industry.

• Producing in the 1000-level clean environment, with high cleanness
• The film surface has no obvious coating lines, the release force is stable and easy to peel off
• High residual adhesion rate (≥85%), Silicon free migration, no performance impact on the bonding material, non-polluting
• Adjustable Release Force: Offers customizable release force (light to heavy) to match adhesive requirements, ensuring stable peeling without residue
• High-Temperature Resistance: Withstands temperatures up to 200 °C+ during processes like battery electrode sintering or ceramic molding
• Surface Uniformity: Smooth/glossy or matte finishes available, free of scratches or coating defects, ensuring consistent production quality

• Display Manufacturing: Applied in LCD/OLED production for residue-free separation between screen layers
• Electronic Component Protection: Shields capacitors, resistors, and semiconductors from contamination during transport and die-cutting
• Flexible Printed Circuits (FPC/PCB): Used as a protective layer during copper foil lamination and circuit etching to prevent adhesion and static damage to components
• New Energy & Materials: Protects battery separators and electrodes during high-temperature lamination processes
• Ceramic/Carbon Fiber Composites: Acts as a release layer for green ceramic sheets and pre-impregnated carbon fiber materials, ensuring smooth demolding

• Products are generally used by cardboard tray, nude tray packaging
• All cartons of products have certificate, packing list, each tray should have a list of products
• Our products can also be packaged according to the requirements of the user agreement