3M Tape Reduces Silicon Contamination in Hightemp Processes

Silicon contamination during PCB soldering processes remains a persistent challenge in electronics manufacturing. Traditional silicon-based tapes often release silicone compounds under high temperatures, which can deposit on PCB surfaces and negatively affect subsequent soldering and coating processes.

In electronic manufacturing, silicon contamination poses significant quality risks. Silicone residues from conventional tapes can lead to poor solder adhesion, delamination, and other defects. These contaminants are particularly problematic as they are difficult to remove and may cause long-term reliability issues, potentially resulting in product failures.

The 3M™ 7419 Low-Static Polyimide Film Tape features a non-silicone adhesive formulation specifically designed for PCB soldering masking and other high-temperature applications. Key advantages include:

• Silicone-free formulation: Eliminates contamination risks while maintaining reliable adhesion
• Exceptional temperature resistance: Withstands short-term exposure up to 260°C (500°F) for 10 minutes while maintaining clean removability
• Chemical resistance: Performs well in harsh chemical masking environments
• Low-static properties: Protects sensitive electronic components from electrostatic discharge
• Clean removal: Leaves minimal residue even after high-temperature processing

The tape serves multiple functions in electronics manufacturing:

• PCB soldering protection during wave or reflow processes
• High-temperature spray masking applications
• Chemical etching protection
• Various high-temperature processing requirements

• Base material: DuPont™ Kapton® polyimide film
• Adhesive: Acrylic
• Color: Amber
• Total thickness: 0.066 mm (2.6 mil)
• Tensile strength: 53 N/cm (30 lbs/in)
• Elongation at break: 70%
• Adhesion: 6.6 N/cm (36 oz/in) to stainless steel
• Dielectric strength: 7 kV
• Flammability rating: UL 510
• Operating temperature range: -73°C to 260°C (-100°F to 500°F)